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ostmann@izm.fhg.de
Andreas Ostmann
Fraunhofer IZM Gustav-Meyer-Allee 25, 13355 Berlin, Germany
email: ostmann@izm.fhg.de
Aktuelle Trends der Verbindungstechnik:
Vom Cu-Drahtbond zum Embedding
ostmann@izm.fhg.de
Elektronik-Packaging
�Heute
� vom Au- und Al- zum Cu-Draht
� Embedding
�Morgen
� Panel Level Packaging
� Power Embedding
�Übermorgen
� Modulare Elektronik
Inhalt
ostmann@izm.fhg.de
Heute
ostmann@izm.fhg.de
Packaging Today
... more than just a handful of types
ostmann@izm.fhg.de
Inside Packages - Interconnect Evolution
chip & wire flip chip chip embedding
established smallest in 2D smallest in 3D
First level chip interconnection technologies inside a package:
ostmann@izm.fhg.de
Wire Bonding – From Au to Cu
Today more than 50 % of all bond wires are Cu
ostmann@izm.fhg.de
Wire Bonding – From Al to Cu for Power Applications
thick Cu wire on IZM power cycling test vehicle
Cu wires and ribbons for high reliability power modules
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First Patent
Chip Embedding - Technology Progress
1968 2000
Basic R&D
2005
Production Demos
2010
Production
Production started
� Japan
� Korea
� Europe
First Standards
� JPCA
Chip Embedding in organic substrates� use of PCB technology & material
ostmann@izm.fhg.de
Chip Embedding – Chances & Challengesvia to substrate via to chip
chip
core substrate adhesive
via to substrate via to chip
chip
core substrate adhesive
dielectric
Advantages
� thin planar packaging, enabling 3D stacking
� improved electrical performance
� cost saving by large area process
Challenges
� improvement of process yield
� new supply chain structure has to be established
ostmann@izm.fhg.de
PCB Embedding Today – Power and Logic
The production of embedded packages is ramping up fastToday 2013: 340 Mio., Forecast 2016; 1700 Mio. (source Yole)
Smart Phone Market• DC/DC converters• Power management units • Connectivity module
Computer market• MOSFET packages• Driver MOS SiPs
PCB Embedding Technology is implemented or will come soon at• PCB manufacturers• Semiconductor manufacturers• OSATS
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� Embedding of power chips into Printed Circuit Board structures� cost saving by large area process � Direct connection by Cu conductors / no bond wires� high reliability by direct Cu to chip interconnects � shielding capability
� Completely planar conductors� multiple wiring layers possible � SMD assembly on top allows driver integration� top side cooling possible� very low parasitic effects
Power Chip Embedding - Features
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Power Chip Embedding – Manufacturing Process
� backside contact by conductive die bond� conductive adhesive� soldering� sintering
� very good thermal conductivity� die attach on thick Cu possible� compatible to standard Ag backside
conductive chip attach
embedding by lamination
via drilling top, through-via
Cu plating and structuring Ag sintered die bond
ostmann@izm.fhg.de courtesy AT&S
Embedded Component Packaging (ECP)
ostmann@izm.fhg.de courtesy AT&S/GaN Systems
Embedded Component Packaging (ECP)
ostmann@izm.fhg.de
Semiconductor Embedded in Substrate (SESUB)
ostmann@izm.fhg.de
Blade Package
SMD power packagea
� embedded MOSFET / Driver
� manufacturing on PCB format
Licensing and process transfer from Fraunhofer IZM
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Morgen
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Today's Packaging – Limited Manufacturing Formats
Leadframe Packaging Strip Packaging Wafer-level PackagingFan-out Wafer-level Packaging
Need for further cost reduction���� Increase of production format size
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From Wafer Size to Panel Size
24“x18“ / 24“x24“12“8“
• Based on standard PCB materials & equipment
• 3D and double sided routing are standard features for PCBs
• Line/space down to 10 µm• Full format/large area is standard
• Based on standard thin film technology equipment
• Tightest tolerances for fine pitch line/space (2/2 µm)
• Currently limited to 12” – 300 mm
Thin Film Technologies
PCB Technologies
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Panel-Level Packaging - PLP
Definition:Throughout manufacturing of packages on large formats
Features
• Lead-less package (BGA, QFN, LGA) • embedded components (active and passive )• components on top• high-density interconnects • 3D capability• rectangular or square production formats 18" - 24“ or larger
singulation
manufacturing on panel-level package / SiP / module
ostmann@izm.fhg.de
PLP Strategies at Fraunhofer IZM
Panel-Size FO WLP PCB Embedding
� Large-area molding 18" x 24"
� Through mold vias for 3D
� Interconnects using PCB
materials & technology
� mold embedding of sensors
� use of new polymers / laminates
� thin layers (10 µm) for high density
� high breakthrough (>40 kV/mm) for power
� improved resolution for interconnects
10 µm � 5 µm � 2 µm
� processes to reduce warpage
ostmann@izm.fhg.de
Fraunhofer IZM Substrate Integration Line
Laser, drilling , lamination 400 m²Lithography (LDI), sputtering 280 m²galvanics, etching 100 m²Assembly, molding, analytics 340 m²
Total area 1120 m²
� High-end manufacturing equipment dedicated to customer-specific R&D� Complete 18" x 24 " PCB manufacturing & assembly line
40 scientist, engineers and technicianswith long-term experience in advanced packaging
PCB laser, drilling & lamination lab
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Datacon evo/ASM Siplace CA3
Mahr OMS 600/IMPEX proX3
WL: Towa up to 8”PL: APIC up to 18”x24”
incl. 12” WL (Q3 – 2014)
Lauffer/Bürkle
Siemens Microbeam/Schmoll Picodrill with
HYPER RAPID 50
Ramgraber automatic plating line
Schmoll MX1 OrbotechParagon Ultra 200
Schmid
Fraunhofer IZM Substrate Integration Line
ostmann@izm.fhg.de
Assembly of 5528 dies on large area 18”x 24” with 6500 dies/h speed
Mold embedding on large area 18”x 24” by sheet lamination
18”x 24” Panel-Level FO WLP
Fully electrical connected WL embedded package stack with TMV & 3D routing
ostmann@izm.fhg.de
Panel Molding 18”x 24” – APIC Yamada
Equipment in Japan before shipment First molded panel 18" x 24 "
Large area compression molding:� Wafer Level: 300 mm up to 450 mm possible� Panel Level: 18” x 24” (456 x 610 mm²)� LaminationUp and Running in Q4/2014
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Übermorgen
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board from Zuse Z23 computer, 1963
SMD board with 01005 components, early 21. century
Electronic System - Quo Vadis?
1950 2000 2050
ostmann@izm.fhg.de
board from Zuse Z23 computer, 1963
SMD board with 01005 components, early 21. century
1950 2000 2050
Modular Electronics ?
Electronic System - Quo Vadis?
ostmann@izm.fhg.de
Today Modular Microsystem
Design
Hardware
Modular Microelectronics - System Concept
SMD components mounted on a PCB stacked modules (functional blocks)
ostmann@izm.fhg.de
Modular System
system control / memory
temperature sensing
power management
Traditional electronic system
resistors
µController
MOSFETflash memory
capacitors
PCB
Pt100
Vision
components on a PCB
3D �stacked modules
stacked modules
Modular Microelectronics – Concept
ostmann@izm.fhg.de
SMD CR
Modular Microelectronics - 1st Level (inside Modules)
Si Chip
Embedded SMD System-in-Packages• embedding of packaged SMDs• required if bare dies are not available• thicker modules (1-2 mm)
Si Chip C
Requirements on Modules:
Embedded Chips System-in-Packages• planar modules with embedded dies
and thin passives• thin modules (ca. 150 µm)
Embedded Thin Chip• all functions integrated in a SoC• ultra-thin (< 100 µm) / CSP form factor
• easy to handle• stackable ⇒⇒⇒⇒ planar• reliable � Embedding Technology
ostmann@izm.fhg.de
Modular Microelectronics – 2nd Level (between Modules)
Soldering• solder • diffusion soldering
Adhesive Joining• ACF• b-stage ICA/NCA
Sintering• Ag sinter paste
Mechanical Connection• „press fit“ contacts • reworkable contacts
� only few contacts between modules
ostmann@izm.fhg.de
Modular Microelectronics - Serial Data Bus
Bus Systems
Name max. Speed no. of I/Os
LIN 0.02 Mbit/s 2
CAN 1 Mbit/s 4
I2C 3,4 Mbit/s 4
USB 2.0 480 Mbit/s 4
USB 3 5000 Mbit/s 6
���� Serial bus connection between modules
Low number of contacts between modules
� simplified assembly process
� high assembly yield
� high reliability
GNDVCCD+ D-
ostmann@izm.fhg.de
component
module
sub-system
system
Modular Microelectronics – From Chip to System
Software Hardware Level Manufacturing
• SemiconductorManufacturer
• Packaging House• PCB Manufacturer
• Packaging House• OEM
• OEM
Bootloader(Firmware)
ApplicationProgram
(Runtime)
ostmann@izm.fhg.de
Modular Sensor – System Concept
I2C Bus
AccelerationSensing
LightSensing
TemperatureSensing
Communication& Power
USB PC
Functions• 3 sensor functions / modules
• acceleration• light• temperature
• communication & power module• USB connection to PC• power conversion 5V (USB) to 3.3 V
Sensor modules connected by I2C bus (4 contacts: SDA, SCL, Vcc, GND)
ostmann@izm.fhg.de
Modular Sensor – System Demonstrator
set of sensor system modules
top side bottom sideISP programming contacts
I2C bus contacts
module x-ray image
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Modular Sensor – Module Packaging
SMD CR
Module realisation• module size: 12 x 12 mm²• SMD assembly on 2-layer core PCB• build-up of outer layers• SMDs embedded into top layer
module after SMD assembly before embedding stack of test modules with embedded LEDs
ostmann@izm.fhg.de
Modular Sensor – Realized Module Stack
x-ray image
sensor module stack
• modules were successfully realized• stack of sensor modules on communication & power module
• basic functional tests passed
Next Steps�implementation of bootloader
software on modules level�implementation of system
control software on stack level�evaluation of different application
scenarios
ostmann@izm.fhg.de
Project WiserBAN
ostmann@izm.fhg.de
Project WiserBAN
Sn3Ag0.5Cu balls to PCB
2,15 mmpiezo+SoC stackwith bumps: 1.5mm
Antenna thickness:650µm
Thickness of the stack� module thickness: 500µm� antenna module: 650µm� piezo+SoC+balls: 1.5mm
Piezo:500µm
SoC:500µm
ostmann@izm.fhg.de
Project – Modular Micro Camera
ostmann@izm.fhg.de
MoMiCa – Modular Camera Module
Motivation• to develop a miniaturized camera modulewith integrated image processing
• using PCB PLP embedding
Potential Applications
traffic lane recognition face / gender recognition
ostmann@izm.fhg.de
MoMiCa – Camera Module
Geometry• 16 x 16 x 3.6 mm³, weight 2 g w/o lens
PCB Layers• 2 + 8 + 1 construction• 8 layer core with stacked mircrovias
Embedded Components• 32 bit microcontroller with image sensor
interface (CogniVue CV2201 BGA 236 )• 256 Mbit Flash Memory (Macronix 8WSON• MOSFET switch (IRF SOIC)• USB ESD protection (NXP SOT457) • 5 DC/DC-converters (Murata)• oscillator 24 MHz (NXP • 2 LEDs (0402)• 34 capacitors (0201, 0603)• 25 resistors (0201)• 3 inductors (0603)
Components on top• 3 MPixel Image Sensor
Omnivision 3642 • lens CMT746 + lens holder• 7 capacitors (0201)• 1 resistor (0201)• 1 inductor (0603)• 1 microswitch
ostmann@izm.fhg.de
MoMiCa - Layer Sequence
SMD Bildsensor
2 Lagen Kern
Bauelemente
3 Build-up Lagen
2 Lagen Kern
3 Build-up Lagen
Bauelemente
Außenlage
ostmann@izm.fhg.de
MoMiCa - PLP Manufacturing
assembled components on bottom inner layer
assembled components on top inner layer
• manufacturing on quarter format (12" x 9")• 77 modules per panel (only partially with components)• double-side component assembly on inner layer• embedding by prepreg lamination• assembly of image sensor on top• testing and programming on panel-level
ostmann@izm.fhg.de
MoMiCa – Camera Module
Modular camera with integrated 32 bit image processor and memory
3 Mpixel image sensor
flash memory
DC/DC converter
capacitor
32 bit microcontroller
ostmann@izm.fhg.de
Embedding Technology
Module Stacking
Modular System
Embedded SiP
Modular System Software
Modular System Architecture
• Embedding technology opens a way over small and robust SiPs towards Modular Microelectronics
• Modular Microelectronics offer much shorter design cycle times
• It can simplify the realisation of complex systems by use of tested functions
Modular Microelectronics – Vision
The Vision:System constructionas easy as Lego
ostmann@izm.fhg.de
Danke für Ihre Aufmerksamkeit
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