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14 to 17 October 2019Museo de Ciencia y Tecnologíadel Estado de VeracruzMurillo Vidal # 1735, Zip 91069Xalapa, Veracruz, Mexico For more informa�on:h�ps://www.uv.mx/ieee-icev/h�ps://easychair.org/cfp/IEEE_ICEV_2019h�ps://www.facebook.com/ICEV2019/
General ChairDr. Jaime Mar�nez-Cas�llojaimar�[email protected]
Co-ChairDr. Jesús García-Guzmá[email protected]
Program Co-ChairsDra. Alma Delia [email protected]
Dr. Jacinto Enrique Pretelí[email protected]
COVEICYDET LiaisonDr. Raúl Ló[email protected]
Industry LiaisonM.C. Rubén Alvaro González-Bení[email protected]
IEEE Veracruz Sec�on LiaisonIng. Cesar [email protected]
Technical Program Commi�eeChairDr. Jaime Ramírez-Á[email protected]
Co-ChairDr. Alejandro Díaz-Sá[email protected] Topics of Interest
Authors are invited to submit contribu�ons including, but not limited to the following areas:
Power and Energy Systems Materials Science and Engineering Nanomedicine and Biomedical Engineering Mechanical Engineering Electrical Engineering Electronics Engineering Mechatronics Engineering Chemical Engineering Computer Systems Engineering Energy Haves�ng Systems Micro and Nanotechnology Micro and Nanosystems Devices and Sensors: CMOS, MEMS, NEMS Modeling and Simula�on Internet of Things (IoT) Electronic Instrumenta�on Engineering Signal Processing Engineering Physics and Op�cal Engineering Civil Engineering Corrosion Engineering Informa�on Technology Technological Educa�onal Innova�on
The submission Web page for IEEE ICEV 2019 is:
h�ps://easychair.org/conferences/?conf=ieeeicev2019.
IEEE International Conference on Engineering Veracruz 2019(IEEE ICEV 2019)®
Innovation and Technology Development CALL FOR PAPERS
IEEE International Conference on Engineering Veracruz 2019(IEEE ICEV 2019)®
Innovation and Technology Development CALL FOR PAPERS
On behalf of the Organizing Commi�ee, we have the pleasure to invite you to submit your contribu�ons to the IEEE Interna�onal Conference on Engineering Veracruz 2019 (IEEE ICEV 2019) (IEEE Congreso Interna-cional de las Ingenierías Veracruz 2019). The conference will be held in the Museo de Ciencia y Tecnología del Estado de Veracruz in Xalapa, Ve-racruz, Mexico from 14 to 17 October 2019, organized by the Universi-dad Veracruzana (DGAAT-Dirección General del Área Académica Técnica) and the IEEE Student Branches with the support of the IEEE Veracruz Sec�on and Consejo Veracruzano de Inves�gación Cien�fica y Desarrollo Tecnológico (COVEICYDET). IEEE ICEV2019 is Technically Sponsored by IEEE. The conference proceedings will be submi�ed for inclusion in IEEE Xplore. Authors from all over the world are invited to submit original and unpublished papers, which are not under review in any other confe-rence. All papers will be peer reviewed by the technical program commi-�ee. Submi�ed papers must be wri�en in English and should be in PDF format. Paper length must be between 4 and 8 pages.
IMPORTANT INFORMATION
Final Extended Deadline: July 1, 2019
No�fica�on of acceptance: July 30, 2019Camera-ready due: September 1, 2019Payment Deadline: September 30, 2019
Registra�on Deadline: Octuber 14, 2019Presenta�on of papers from: 14 to 17 October 2019
