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Fakultät Elektrotechnik und Informationstechnik Institut für Aufbau- und Verbindungstechnik der Elektronik

Packaging for Systemintegration

Prof. Dr.-Ing. habil. Klaus-Jürgen Wolter


Electronics Packaging

Procedures, processes and technologies to assemble

electronic components and microtechnical modules

Holistic approach

Semicon - NanoZeit 20.10.2010

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Fields of activity of the Electronics Packaging Lab

Bio-compatible electronics packaging PD Dr. Jürgen Uhlemann

Thick-film technology Dr. Marco Luniak

Photonic Packaging Dr. Ralf Rieske

Wire bonding and Flip Chip technology Prof. Dr. Thomas Zerna

Adhesive technology Dr. Angelika Paproth

Assembly technologies Prof. Dr. Thomas Zerna

Non-destructive inspection Dr. Martin Oppermann

Board Level Reliability Dr. Mike Röllig

Quality assurance in electronics Dr. Heinz Wohlrabe

Process technology PD Dr. Gerald Weigert

Young Scientists Group „High Reliable 3D-Microsystems“

DI Karsten Meier


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System Integration

Source: ITRS Roadmap


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Status of System in Package

Source:Röllig et.al.


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3D-Integration, Stacked Packages

Source: ITRS 2006


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stacked die memory with spacer

Quelle:

TechSearc

h I

nte

rnational

3D-Integration

3D-Integration


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3D-IC-Integration

Source: Lau; ECTC 2010


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Si-TSV-Technologies

Via first Via Middle Via Last

Source: ITRS Roadmap 2009


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SLID – Motivation & Concept

20.10.2010

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ww

w.m

eta

llurg

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ist.

go

v

Cu-Sn phase diagram

1. before bonding 3. after bonding – SLID contact

SLID

Cu-Sn Au-Sn

Cu-SnAg …

thermostable joints (IMCs)

enables multistacking of chips

small joints (<10µm)

low bond loads

relatively simple processing

low-lost technology

http://www.metallurgy.nist.gov/








SLID

- Sn electroplating; - SLID process parameter optimization; - SLID microstructure & reliability characterization.

Cu

Cu6Sn5 , Cu3Sn

Cu Cu

Cu

Cu6Sn5 , Cu3Sn

voids Sn

Hull cell for Sn electroplating

Electroplated Sn

20.10.2010

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Self-Alignment


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self-alignment for electronics packaging:

• well-known phenomenon of SMT: self-alignment by liquid solder

Reflow

magnetic:

S.B. Shetye et al.,

University of Florida

by liquid: electrostatic:

J. Dalin, J. Wilde

Universität Freiburg

surface tension

Capillary action

• various research on self-alignment in the past:

• basic principle: force on the component in the direction

of the minimisation of free energy


ACANWF Technology

20.10.2010 Semicon - NanoZeit

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• ACANWF = Anisotropically Conductive Adhesive NanoWire Film:

structured NW-arrays with 109-1010 NWs cm-²

molded in a polymer matrix with adhesive properties

anisotrope conductive and adhesive film for assembly of semiconductor

components

• advantages:

electr. bonded NW: electrical interconnection

heat transfer (thermal management)

pitch >= 100 nm; diameter >= 40 nm (pro NW)

film enables easy handling processes and adjustable thickness & NW-

resolution

metallic NWs polymer matrix

TSV (Cu)

passivation layer (SiO2, TaN, …)

Si

SiO2

adhesion promoter (mono layer)

Chip level

ACANWF


Nanowires

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• template-based plating process of Ag-nanowires (cooperation YRG+IFW Dresden):

cross section:

l = ~4 µm

p = 100 nm, d = ~50 nm

Top view:

template reveals

well organized

array of pores



FEA of TSV structures


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• application fields of finite element analysis:

detect critical locations in TSV/die structure

calculate and estimate appearing loads

evaluation of crack risk

evaluation of delamination appearance

references on die layout/design to

minimize loads

Through Silicon Vias (TSV‘s) as a Key Technology in 3D Integration:

• enable connection through multiple die-/functional-levels

von-Mises stress distribution on a TSV-Cluster heated up to 150 °C


LIT

- Electronic assemblies contain electrical conductive parts

→ inductive heating sources

- Amplitude modulated high power el.-mag. field

→ modulated heat sources

- Thermal diffusion wave gets attenuated & delayed

- Evaluation: Fourier transformation of Tsurface(t) at flock-in


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Application of 3D-IC-Integration


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Source: ITRS Roadmap 2009


Hetero System Integration


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Heteo-System-Integration


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Application of Hetero-System-Integration

HF-

Baugruppe

HF Antenne

US-Sensoren / Aktoren

(MEMS)

Signal-

Wandlung

Power

Management

Piezoelektrischer

Energiewandler

Mechanische Energie (J)

Energiespeicher

Timing

Mikro-

Rechner

Funk-Interface

Datenspeicher

SoC

WL-AVT

Prüfalgorithmen

Modul-AVT

Funknetzwerk

Protokoll-Software

Auswertung

Applikation

[Hentschel, IzfP-D]


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http://upload.wikimedia.org/wikipedia/commons/thumb/c/cb/Crystal-oscillator-IEC-Symbol.svg/120px-Crystal-oscillator-IEC-Symbol.svg.png


Microfluidic Systems

Components for microfluidic systems and sensors

• Ceramic-MEMS (MCMs, Sensor elements, hybrid modules)

• Embedded structures in ceramic substrates for special applications (fluidic)

Cross section of a multilayer LTCC with embedded micro-channel

Principle of a LTCC based micro fluid system

Challenge for future substrates:

• Application of pastes with line width below 40µm

Fine line printing of conducting lines


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Sensor Systems

Ultrasonic Phased Array Sensor Head

Adaption layer

Sensor

Damping

Koaxialkabel

Housing

flexible Substrate

Molding

Goals: • Development of High Frequency Phased Array Sensor Heads (up to 50 MHz) • Development of an alternative coupling concept for fast inline inspection in

electronics production


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Phased Array Matrix,

each column 50 x 50 µm


Sensor Systems

Detector

Absorber

Protected electronics

Aperture

X-Ray


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Direct converting detector


Photonic Packaging

Coupling concepts: • Direct coupling (without optics for redirection and collimation but precise

mechanical alignment) • Indirect coupling (redirection, often focusing elements)

optical transmitter (VCSEL)/optical receiver (PD)

cladding

core

cladding

PCB integrated waveguide

electrical layer

optical transmitter (VCSEL)/optical receiver (PD)

cladding

core

cladding

45° reflective mirror

PCB integrated waveguide

electrical layer

Schematic diagram of coupling strategies, direct butt-coupling (left) and indirect coupling with beam redirection

Challenges: • Development of low-loss materials with increased thermal stability • Fast large-area detectors • Efficient coupling strategies that preferably base on passive alignment and surface

mount technology • Design software must address specific design rules and must be enhanced by

simulations


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Board level reliability

Board level reliability

• FEM analysis

• Life time prediction

• Physics of failures

• Characterization of material behavior

• Determination of failure modes of packaging structures

Cross section of a BGA with polymeric core solder joint and its representation by a FEM mesh

Crack in a FBGA joint, detailed view of the downer left side of the joint


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Non-destructive inspection

Exploitation of new application possibilities for standard processes

• Ultrasonic inspection

• X-ray microscopy

• X-ray computed tomography

Geometrical characterization of surfaces

Tomography of µBGA balls to detect voids Surface characterization using confocal microscopy, resolution in z - direction <1nm possible


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• Combination of electrical, mechanical, optical and fluidic functions in one package.

• Increasing functionality and therefore higher integration density per

volume. • Higher clock rates and higher performance of signal processing,

especially for in-situ sensors.

• Wireless electrical power supply (Energy Harvesting / Energy Storage).

• Wireless communication with high data rates. • Systemintegration of sensors and actuators.

Advantages of Hetero-System-Integration


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Packaging for Systemintegration - TU Dresden › etit › ... › dokumente › NanoZEIT › ... · Fakultät Elektrotechnik und Informationstechnik Institut für Aufbau- und Verbindungstechnik