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unternehmensbroschuere 2019 englisch...PCB: 50x50xo.5 to AOI system Selective soldering unit & wave soldering unit Rework station (BGA) Environmental chambers from -750C to +1800C

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Page 1: unternehmensbroschuere 2019 englisch...PCB: 50x50xo.5 to AOI system Selective soldering unit & wave soldering unit Rework station (BGA) Environmental chambers from -750C to +1800C

Page 2: unternehmensbroschuere 2019 englisch...PCB: 50x50xo.5 to AOI system Selective soldering unit & wave soldering unit Rework station (BGA) Environmental chambers from -750C to +1800C

Page 3: unternehmensbroschuere 2019 englisch...PCB: 50x50xo.5 to AOI system Selective soldering unit & wave soldering unit Rework station (BGA) Environmental chambers from -750C to +1800C

Page 4: unternehmensbroschuere 2019 englisch...PCB: 50x50xo.5 to AOI system Selective soldering unit & wave soldering unit Rework station (BGA) Environmental chambers from -750C to +1800C

Page 5: unternehmensbroschuere 2019 englisch...PCB: 50x50xo.5 to AOI system Selective soldering unit & wave soldering unit Rework station (BGA) Environmental chambers from -750C to +1800C

Page 6: unternehmensbroschuere 2019 englisch...PCB: 50x50xo.5 to AOI system Selective soldering unit & wave soldering unit Rework station (BGA) Environmental chambers from -750C to +1800C

myAVR Technische Beschreibung technical descriptionsisy.name/mymcu_download/produkte/mymultiprog-mk3/...PCB material FR8, thickness 1.5 mm, Cu layer 0.35 µm, two-sided, soldering

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