Oppo Reno3 5G Sub-6 Front-End Module - System Plus Consulting · 2021. 5. 6. · SKY78191 Skyworks LB PAMiD XX X XX % $ XX SKY53735 Skyworks LB/LMB/MB/HB Diversity XX X XX % $ XX

©2021 by System Plus Consulting | SPR21624 – Oppo Reno3 5G Sub-6 Front-End Module | Sample 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

REVERSE COSTING® – STRUCTURE? PROCESS AND COST REPORT

CLICK TO EDIT MASTER TITLE STYLE

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Study of innovative 5G Sub-6 modules from Qorvo and Skyworks integrated into Oppo’s phones.SPR21624 - RF report by Stéphane ELISABETH

Laboratory Analysis by Nicolas RADUFEMay 2021 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Oppo Reno3 5G Sub-6 Front-End Module

http://www.systemplus.fr/



Table of Contents

Overview / Introduction 5

o Executive Summary

o Reverse Costing Methodology

Company Profile 9

o Oppo

o Oppo Reno3 5G Teardown

o Qorvo

o Skyworks

o Ranking: 4G/5G band, Module Area and cost per Supplier

Market Analysis 29

o Supplier Landscape

o Market Share and Forecast

Physical Analysis 33

o Summary of the Physical Analysis 34

o Qorvo 36

o QM77040 3G/4G/5G MB/HB PAMiD Analysis 38

✓ Module Views & Dimensions

✓ Module Opening

✓ Module Cross-Section

✓ Summary of Physical Data

✓ Die Analysis: Switch, Filters

o Skyworks 110

o SKY58254 4G/5G B41/n41 PAM Analysis 112

o SKY58255 5G n78/n79 PAM Analysis 159

o SKY53728 5G UHB Diversity Module Analysis 194

o SKY53735 4G/5G LM/LMB/MB/HB

Diversity Module 214

Physical Comparison 248

o Qorvo QM77040 vs. Qualcomm QPM5670

o Skyworks SKY58254 vs. Qualcomm QPM6585 vs. Qorvo QM78041

Manufacturing Process 258

o Dies Front-End Process & Fabrication Unit

o Final Test & Packaging Fabrication unit

o Summary of the main parts

Cost Analysis 281

o Summary of the cost analysis 282

o Yields Explanation & Hypotheses 283

o Qorvo QM77040 3G/4G/5G MB/HB PAMiD 284

✓ Die Front-End Cost

✓ Die Cost

o Skyworks SKY53735 4G/5G LM/LMB/MB/HB

Diversity Module 308

o Skyworks SKY58255 5G n78/n79 PAM Analysis 327

o Skyworks SKY53728 5G UHB Diversity Module Analysis 345

o Skyworks SKY58254 4G/5G B41/n41 PAM Analysis 359

Selling price 379

Feedback 385

Related Analyses 387

System Plus Consulting Services 389



Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedback

Related Analyses

About System Plus

Executive Summary

Qualcomm is currently the leader of the 5G market with several design wins in 2019 and 2020. But the company is not the only supplier ofmodules for 5G Sub-6 GHz frequency band communication. Qorvo and Skyworks follow Qualcomm in the rankings and could overtake it inthe next few years. In the Reno3 5G, Oppo chose these two suppliers for the Radio Frequency Front-End (RFFE) for 4G and 5G. Both bringgood alternatives to Qualcomm’s components and offer cost-effective solutions.

Among the first 5G phones on the market in 2019, the Oppo Reno3 series has a different structure for the RF Front-End Module (FEM).The Pro version is based on a complete Qualcomm chipset from the modem to the antenna tuner. The standard version, studied in thisreport, features a modem and a transceiver from MediaTek and a complete RFFE split between Skyworks and Qorvo.

Qorvo supplied the QM77040 3G/4G/5G Mid/High Band (MB/HB) Power Amplifier integrated Duplexer (PAMiD), mostly with 4Grefarming bands for 5G. The device features several dies showing different innovations from the latest generation of PA to generation 4and 5 Bulk Acoustic Wave (BAW) filter.

Skyworks supplies all the others main components: 4G Low/Low-Mid/Mid/High-band (LB/LMB/MB/HB) Diversity module (SKY53735),4G/5G B41/n41 PAMiD (SKY58254), 5G n78/n79 Low Noise PAMiD (L-PAMiD) (SKY58255), and 5G n78/n79 Diversity (SKY53728).

The report contains a complete analysis of the main FEM System-in-Package (SiP), including a detailed analysis of the switches, the LowNoise Amplifier (LNA), the filtering dies, and the internal/external Electromagnetic Interference (EMI) shielding. The report also featuresa cost analysis and a price estimation of the chipset. Finally, it also integrates a comparison of the Qorvo QM77040 with the QualcommQPM5670, and the Skyworks SKY58254 with the Qorvo QM78041 and the Qualcomm QPM6585.



Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary


Physical Analysis

Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

Executive Summary

Antenna #XX

Antenna #XX

Antenna #XX

Antenna #XX

RxTx

n77/n78/n79

Rx

MT6191LNA

Rx

Tx

n41

Rx

n41/LB/MB/HB

Tx

LB

Tx

MB/HB

Antenna #XX

Antenna #XX

Antenna #XX

Rx

LB/LMB/MB/HB

Antenna #XX

Antenna #XX

RF Components(Marking)

Manufacturer Band Type Area(mm²)

Quantity RF Board Proportion

Cost

SKY78191 Skyworks LB PAMiD XX X XX % $ XXSKY53735 Skyworks LB/LMB/MB/HB Diversity XX X XX % $ XXQM77040 Qorvo MB/HB PAMiD XX X XX % $ XXSKY58255 Skyworks n78/n79 L-PAMiD XX X XX % $ XXSKY53728 Skyworks n78/n79 Diversity XX X XX % $ XXSKY58254 Skyworks B41/n41 PAMiD XX X XX % $ XX

Total XX X XX % $ XX

Note:Discrete filters and Switches are notincluded in this report. Only the mainFEM are analyzed.

Analyzed in this report



Overview / Introduction

Company Profile & Supply Chain o Oppoo Oppo Reno3 5G Teardowno Qorvoo Skyworkso Rankingo Supplier Landscapeo Market Share and Forecast

Physical Analysis

Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

Oppo Reno3 Teardown

Oppo Reno3 5G Overview©2021 by System Plus Consulting

Oppo Reno3 5G Opened View©2021 by System Plus Consulting

Oppo Reno3 5G Board©2021 by System Plus Consulting

Smartphone Area:~XX mm²

Footprint area:~XX mm²

Total board Area:~XX mm²

RFFE area: ~XX mm²





Physical Analysis o Qorvo

o QM77040 3G/4G/5G MB/HB PAMiD

o Skyworkso SKY58254 4G/5G B41/n41

PAMiDo SKY58255 5G n78/n79 L-

PAMiDo SKY53728 5G UHB Diversity

Moduleo SKY53735 4G/5G

LM/LMB/MB/HB Diversity Module

Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

Summary of the Physical Analysis

SiP Assembly:

o XX

o Electrical Connections and support:

XX

o Special Features:

XX

Components:

✓ Power amplifier:

o WLCSP, Bipolar XX

o Substrate: XX

o Placement : XX

✓ Switch #1:

o WLCSP, CMOS XX µm XP XM

o Substrate: XX

o Placement : XX

✓ Switch #2:

o WLCSP, CMOS XX µm XP XM

o Substrate: XX

o Placement : XXQorvo QM77040 Assembly©2021 by System Plus Consulting

Filter Die:

o Cu Flip, SMR BAW Filter

o Placement : XX

PCB Substrate

Dies

Filters












Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

Package Overview

Functional Block Diagram©2020 by System Plus Consulting

Package Top View – Optical View©2020 by System Plus Consulting












Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

Power Amplifier – Die Cross-Section

Die Cross-Section – SEM View©2020 by System Plus Consulting

CollectorContact


HBT StructureQorvo












Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

Filters – Die Overview – High-Band

Package Top View – Optical View©2020 by System Plus Consulting

Die Area : XX mm² (XX x XX mm)(Die 1)

BAW Gen 5

Die Area : XX mm² (XX x XX mm)

(Die 2)

BAW Gen 5


(Die 3)

BAW Gen 5


(Die 5)

BAW Gen 5

Die Area : XX mm² (XX x XX mm)(Die 4)

BAW Gen 5












Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

Filters – Die Cross-Section – Gen. 5

Qorvo’s BAW Gen. 5 – Die Cross-Section Plan

©2020 by System Plus Consulting













Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

Switch – Die Overview

Die Top View – Optical View©2020 by System Plus Consulting

CouplerCoupler Switch XPXT

PA Switch XPXT












Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

n41 Filter – Die Overview

Die Overview – n41 Filter– Optical View©2020 by System Plus Consulting

Die Overview – n41 Filter– Schematic View©2020 by System Plus Consulting












Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

Switch – Die Cross-Section


Silicon Substrate

Poly #X

Polysilicon layer (XX µm)

BOX

Silicon Thin Layer

W Plug

MX (Cu)

MX (Al)

• XX• XX












Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

Package Cross-Section

Package Cross-Section – SEM View©2020 by System Plus Consulting



XX Layer (XX µm)

XX Layer (XX µm)

XX Layer (XX µm)XX Layer (XX µm)

XX Layer (XX µm)

XX Layer (0.11 µm)

Package Molding

Package Molding

• XX












Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

LNA – Die Overview

Die Top View – Optical View©2020 by System Plus Consulting

Input Switch XPXT Ouput Switch XPXTLNA #XX

LNA #XX





Physical Analysis

Physical Comparisono Qorvo QM77040 vs. Qualcomm

QPM5670o Skyworks SKY58254 vs.

Qualcomm QPM6585 vs. Qorvo QM78041


Cost Analysis


Feedback

Related Analyses

About System Plus

4G/5G MB/HB PAMiD – Power Amplifier

Power Amplifier Die View©2020 by System Plus Consulting

XXXXXX

• XX.

• XX

QM77040 – Opening – Optical View©2021 by System Plus Consulting

QPM5670 – Opening – Optical View©2021 by System Plus Consulting





Physical Analysis





Cost Analysis


Feedback

Related Analyses

About System Plus

Device QM78041 QPM6585 SKY58254

PA X (XX) +XX % X (XX) +XX % X (XX)

Switch X (XX) x XX X (XX) -XX % X (XX)

ET - +XX % X (XX) -XX % -

ASM - +XX % X (XX) -XX % -

PMIC X (XX) -XX % X (XX) +XX % X (XX)

BAW Filter X (XX) +XX % X (XX) -XX % -

SAW Filter - - - +XX % X (XX)

IPD Filter - - - - -

Coupler X (XX) -XX % - - -

SMD 0201 - +XX % X (C) -XX % -

SMD 01005 X (L), X (C) +XX% XX (L), XX (C) -XX % X (L), X (C), X (R)

4G/5G B41/n41 PAMiD

Qorvo QM78041 Top/Bottom/Side View©2020 by System Plus Consulting

Qualcomm QPM6585 Top/Bottom/Side View©2020 by System Plus Consulting

Skyworks SKY58254 Top/Bottom/Side View©2020 by System Plus Consulting

QM78041 QPM6585 SKY58254

Package Type XX-pin LGA +XX % XX-pin LGA -XX % XX-pin LGA

Dimensions XX x XX x XX mm +XX % XX x XX x XX mm -XX % XX x XX x XX mm

Thickness XX mm +XX % XX mm -XX % XX mm

Area XX mm² +XX % XX mm² -XX % XX mm²

Pin Pitch XX mm -XX % XX mm -XX % XX mm

• XX





Physical Analysis





Cost Analysis


Feedback

Related Analyses

About System Plus

4G/5G B41/n41 PAMiD – Filter

QM78041 – Opening – Optical View©2021 by System Plus Consulting

QPM6585 – Opening – Optical View©2021 by System Plus Consulting

SKY58254 – Opening – Optical View©2021 by System Plus Consulting

Filter Die View©2020 by System Plus Consulting

• Qorvo BAW Filter

• XX resonator/mm²

• Qualcomm BAW Filter:


• Skyworks SAW Filter:






Physical Analysis

Physical Comparison

Manufacturing Process Flowo Dies Front-End Process &

Fabrication Unito Final Test & Packaging

Fabrication unito Summary of the main parts

Cost Analysis


Feedback

Related Analyses

About System Plus

Global Overview – 4G LB/LMB/MB/HB Diversity

Surface Micro-machiningXX Lithography steps

CMOS Transistors manufacturing on XX SubstrateXX µm, XP XM

XX Lithography stepsFilter

Probe testDicing

Assembly in SiP packageFinal test

SKY53735

LNA





Physical Analysis

Physical Comparison


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso Qorvo 3G/4G/5G MB/HB

PAMiDo Skyworks 4G/5G


o Skyworks 5G n78/n79 L-PAMiDo Skyworks 5G UHB Diversity

Moduleo Skyworks 4G/5G B41/n41

PAMiD

Cost Comparison


Feedback

Related Analyses

About System Plus

Synthesis of the cost analysis

QM77040 SKY53735 SKY58255 SKY53728 SKY58254

Function PAMiD LB/LMB/MB/HB Diversity

n78/n79 L-PAMiD n78/n79 Diversity B41/n41 PAMiD

Switch Manufacturer

Switch Wafer Cost $XX $XX $XX

Switch Die Cost $XX $XX $XX

LNA Manufacturer

LNA Wafer Cost $XX $XX $XX

LNA Die Cost $XX $XX $XX

Component price $XX $XX $XX $XX $XX

Supplier

Final Price $XX $XX $XX $XX $XX





Physical Analysis

Physical Comparison








PAMiD

Cost Comparison


Feedback

Related Analyses

About System Plus

Filter Front-End Cost

The front-end cost for the filter is estimated at $XX in 2020.

The largest portion of the manufacturing cost is due to theconsumables at XX%.





Physical Analysis

Physical Comparison








PAMiD

Cost Comparison


Feedback

Related Analyses

About System Plus

By adding the probe test cost and the dicing, the Switch wafer cost isestimated at $XX in 2020.

The number of good dies (XX x XX mm) per wafer is estimated at XX in 2020,which results in a die cost at $XX.

Switch #1 Front-End Wafer & Die Cost





Physical Analysis

Physical Comparison








PAMiD

Cost Comparison


Feedback

Related Analyses

About System Plus

The total BOM cost is estimated at $XX in 2020.

o The Filter dies represents XX % of the BOM cost.

o The Switch represents XX% of the BOM cost.

o The Power Amplifier dies represents XX % of the component cost.

o The SMD Components and the PMIC represents XX % of the componentcost.

System in Package BOM Cost





Physical Analysis

Physical Comparison








PAMiD

Cost Comparison


Feedback

Related Analyses

About System Plus

Filter Front-End Cost per process steps

• XX

• XX





Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Definitions of Priceo Manufacturer Financialso Complete Module Price

Feedback

Related Analyses

About System Plus

4G LB/LMB/MB/HB Diversity FEM Estimated Selling Price

We estimate that Skyworks realizes a grossmargin of XX% on the module, which results ina final component price at $XX.

This corresponds to the selling price for largevolume to OEMs.


R E L A T E DA N A L Y S E S




Physical Analysis

Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Plus

Related Analyses

RELATED MONITORS

RELATED TEARDOWN TRACKSRELATED REPORTS

By System Plus Consulting:• RF Front-End Module

Comparison 2021 – Vol. 2 –Focus on 5G Chipset

• Apple iPhone 12 series mmWave 5G Chipset and Antenna

• RF Front-End Module Comparison 2021 – Vol. 1 –Focus on Apple

By Yole Développement:• 5G Packaging Trends for

Smartphones 2021

• 5G’s Impact on RF Front-End for Telecom Infrastructure 2021

By System Plus Consulting:• OPPO Reno3 5G 12GB RAM

By System Plus Consulting:• Smartphone Design Win

Quarterly Monitor


https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-2-focus-on-5g-chipset/

https://www.systemplus.fr/reverse-costing-reports/apple-iphone-12-series-mmwave-5g-chipset-and-antenna/

https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2021-vol-1-focus-on-apple/

https://www.i-micronews.com/products/5g-packaging-trends-for-smartphones/

https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-for-telecom-infrastructure-2021/

https://www.reverse-costing.com/teardowns/oppo_reno_3/#features

https://www.systemplus.fr/monitors/smartphone-design-win-quaterly-monitor/

COMPANYSERVICES




Physical Analysis

Physical Comparison


Cost Analysis


Feedback

Related Analyses

About System Pluso Company serviceso Contact

A Structure, Process and Cost Analysis

Reverse Costing® consists of disassembling a device or a system in orderto identify its technology and discern its manufacturing processes andthen using in-house models and tools to determine its cost.

Our Core Activity : Reverse Costing®





Physical Analysis

Physical Comparison


Cost Analysis


Feedback

Related Analyses


Fields Of Expertise





Physical Analysis

Physical Comparison


Cost Analysis


Feedback

Related Analyses


Business Model

Teardown Track

205+ teardowns per

year

Monitor1 per year quarterly updated

Custom Analysis150 custom analyses per

year

Report60+ per year

Costing Tools

5 process-based and 3 parametric

costing tools

Cost MethodsTrainingOn demand





Physical Analysis

Physical Comparison


Cost Analysis


Feedback

Related Analyses


Worldwide Presence

100+ collaborators in 8 different countries

Headquarters› Nantes – System Plus Consulting› Lyon – Yole Développement

Boise

CorneliusRaleighPhoenix

Austin

Singapore

Hsinchu

TokyoShenzhen

Seoul

Frankfurt

Nantes

Lyon





Physical Analysis

Physical Comparison


Cost Analysis


Feedback

Related Analyses


Contact

HEADQUARTER & CUSTOM PROJECT SERVICES

22 Bd Benoni Goullin44200 Nantes, France

[email protected] - +33 2 40 18 09 16

REPORTS & MONITORS WEBSITE

www.systemplus.fr

TRACKS WEBSITE

www.reverse-costing.com

MARKETING, COMMUNICATION & PR

Jean-Christophe Eloy, Marketing & Communication

[email protected] - +33 686 68 19 31

Sandrine Leroy, Public [email protected] - +33 4 72 83 01 89

Western US & Canada

Steve Laferriere - [email protected]

+ 1 310 600 8267

Eastern US & Canada

Chris Youman - [email protected]

+1 919 607 9839

Europe and RoW

Lizzie Levenez - [email protected]

+49 15 123 544 182

Benelux, UK & Spain

Marine Wybranietz -

[email protected]

+49 69 96 21 76 78

India and RoA

Takashi Onozawa - [email protected]

+81 80 4371 4887

Greater China

Mavis Wang - [email protected]

+886 979 336 809 +86 136 6156 6824

Korea

Peter Ok - [email protected]

+82 10 4089 0233

Japan

Miho Ohtake - [email protected]

+81 34 4059 204

Japan and Singapore

Itsuyo Oshiba - [email protected]

+81 80 3577 3042

Japan

Toru Hosaka – [email protected]

+81 90 1775 3866

Follow us on

REPORTS, MONITORS & TRACKS


mailto:[email protected]


http://www.reverse-costing.com/













https://twitter.com/system_plus

https://www.linkedin.com/company/system-plus-consulting/

https://www.youtube.com/user/SystemPlusConsulting

https://www.slideshare.net/system_plus

Documents

Oppo Reno3 5G Sub-6 Front-End Module - System Plus Consulting · 2021. 5. 6. · SKY78191 Skyworks LB PAMiD XX X XX % $ XX SKY53735 Skyworks LB/LMB/MB/HB Diversity XX X XX % $ XX